Japan, Feb. 27 -- TOSHIBA ELECTRONIC DEVICES & STORAGE CORP,TOSHIBA CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:
Application Number: JP,2022-150316
Category (FI): H01L29/78,658@E,H01L29/78,652@B,H01L29/78,653@A,H01L29/78,652@M,H01L29/78,658@F,H01L29/78,658@G,H10D30/01,301@E,H10D30/01,301@F,H10D30/01,301@G,H10D30/66,101@B,H10D30/66,102@D,H10D30/66,102@F,H10D30/66,201@A,H10D30/66,102@S
Stage: PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing a contact resistance with a metal electrode.SOLUTION: A semiconductor device includes: a semiconductor part including a first semiconductor layer of a first conductivity type and a ...