Japan, Sept. 3 -- WASEDA UNIV has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND BONDING METHOD.' Other related details are as follows:
Application Number: JP,2022-137056
Category (FI): H01L21/52@B,H01L21/60,311@Q,H10W72/00,101@Q,H10W72/30@B
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 30, 2022
Publication Date: March 13, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....