Japan, Sept. 28 -- TOKYO OHKA KOGYO CO LTD has got intellectual property rights for 'RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND POLYMER COMPOUND.' Other related details are as follows:

Application Number: JP,2023-026053

Category (FI): G03F7/20,521,C07D333/76,G03F7/004,503@A,G03F7/039,601,C08F220/10

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Feb. 22, 2023

Publication Date: Sept. 3, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....