Japan, Aug. 6 -- AJINOMOTO CO INC has got intellectual property rights for 'RESIN SHEET FOR FORMING INSULATION LAYER OF SEMICONDUCTOR PACKAGE SUBSTRATE.' Other related details are as follows:

Application Number: JP,2024-023856

Category (FI): C08L101/00,H10W70/695,H01L23/14@R,B32B27/18@B,C08K3/013,C08K5/29

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Feb. 20, 2024

Publication Date: Sept. 1, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....