Japan Intellectual Property Rights: RESIN SEALING DEVICE AND RESIN SEALING METHOD

Japan, July 14 -- APIC YAMADA CORP has got intellectual property rights for 'RESIN SEALING DEVICE AND RESIN SEALING METHOD.' Other related details are as follows:

Application Number: JP,2023-070696

Category (FI): H10W74/01@R,B29C43/34,H01L21/56@R

Stage: PROBLEM TO BE SOLVED: To improve quality of a resin sealed molding.SOLUTION: A resin sealing device comprises: a resin sealing metal mold that includes a first metal mold and a second metal mold that is opposite to the first metal mold; a loader hand that conveys a resin material and a plate-like member; a resin guard that is attached to an attachment surface of the loader hand; a resin material supply part that supplies the resin material; and a plate-like member supply part that supplie...