Japan, April 22 -- APIC YAMADA CORP has got intellectual property rights for 'RESIN SEALING APPARATUS.' Other related details are as follows:
Application Number: JP,2022-006076
Category (FI): B29C43/32,H01L21/56@R,H10W74/01,H10W74/01@R,B29C43/18
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 19, 2022
Publication Date: July 31, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....