Japan, Sept. 3 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE.' Other related details are as follows:
Application Number: JP,2022-079670
Category (FI): C08K3/22,C08L101/00,C08K3/24,C08K5/057,C08K5/54,C08K5/541,H10W74/47,H01L23/30@R,C08G59/40,C08L63/00@C
Stage: Grant (IP right granted following substantive examination.)
Filing Date: May 13, 2022
Publication Date: Nov. 24, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....