Japan, Sept. 3 -- AJINOMOTO CO INC has got intellectual property rights for 'RESIN COMPOSITION, RESIN PASTE, CURED PRODUCT, SEMICONDUCTOR CHIP PACKAGE AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2024-209955
Category (FI): C08L63/00@C,C08K5/5415,H10W74/47,C08K3/013
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 3, 2024
Publication Date: March 5, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....