Japan, March 27 -- DIC CORP has got intellectual property rights for 'RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, AND RESIST MEMBER.' Other related details are as follows:

Application Number: JP,2022-054301

Category (FI): C08G59/40,C08L101/06,C08L35/00,G03F7/027,G03F7/027,502,G03F7/027,503,G03F7/027,513

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 29, 2022

Publication Date: Oct. 12, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....