Japan, Sept. 28 -- DISCO CORP has got intellectual property rights for 'PROCESSING METHOD OF WAFER.' Other related details are as follows:
Application Number: JP,2022-145752
Category (FI): H10P52/00@R,H01L21/78@Q,H10P54/20,201,H10P58/00@Q,H01L21/304,601@Z,H10P95/60@Z
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Sept. 14, 2022
Publication Date: March 27, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....