Japan, April 1 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'PROCESSING METHOD OF WAFER.' Other related details are as follows:
Application Number: JP,2022-017937
Category (FI): B23K26/364,H01L21/78@P,H10P58/00@F,H10P58/00@P
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Feb. 8, 2022
Publication Date: Aug. 21, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....