Japan, Feb. 27 -- DAIKIN IND LTD has got intellectual property rights for 'POWER MODULE AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2024-027716
Category (FI): H01L25/04@C,H10W90/00,800,H10W40/60@M
Stage: PROBLEM TO BE SOLVED: To facilitate the dissipation of heat generated in a semiconductor element.SOLUTION: A first wiring member (11) has a mounting surface (15) on which a semiconductor element (2) is mounted, and an exposed surface (16) that is exposed on the side opposite to the mounting surface (15). A second wiring member (12) is disposed at a distance from the first wiring member (11) in a direction perpendicular to the thickness direction of the first wiring member (11). A holding member...