Japan, June 10 -- SEIKO EPSON CORP has got intellectual property rights for 'PLASTICIZING EQUIPMENT, THREE-DIMENSIONAL MOLDING EQUIPMENT, AND INJECTION MOLDING EQUIPMENT.' Other related details are as follows:

Application Number: JP,2022-120102

Category (FI): B33Y30/00,B29C64/209,B29C64/106,B29C45/03

Stage: Grant (IP right document published.)

Filing Date: July 28, 2022

Publication Date: Feb. 8, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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