Japan, July 27 -- SEIKO EPSON CORP has got intellectual property rights for 'PLASTICIZATION DEVICE, INJECTION MOLDING DEVICE AND THREE-DIMENSIONAL MOLDING DEVICE.' Other related details are as follows:
Application Number: JP,2022-087518
Category (FI): B33Y30/00,B29C64/118,B29C45/54
Stage: Grant (IP right granted following substantive examination.)
Filing Date: May 30, 2022
Publication Date: Dec. 12, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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