Japan Intellectual Property Rights: PHOTOSENSITIVE RESIN COMPOSITION, TRANSPARENT SUBSTRATE WITH FRAME MEMBER, AND SEMICONDUCTOR DEVICE

Japan, Oct. 27 -- KANEKA CORP has got intellectual property rights for 'PHOTOSENSITIVE RESIN COMPOSITION, TRANSPARENT SUBSTRATE WITH FRAME MEMBER, AND SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2023-054086

Category (FI): H10W76/18@A,H10F77/50,H10F77/00,H10F39/12@D,H01L31/02@B,H01L27/146@D,H01L23/08@A,H01L23/02@F,G03F7/038,503,G03F7/004,505,G03F7/004,503@Z,G03F7/004,501,C08G59/02,H10W76/10@E,H10W76/10@F

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 29, 2023

Publication Date: Oct. 10, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....