Japan, Oct. 27 -- RESONAC PACKAGING CORP has got intellectual property rights for 'PACKING MATERIAL FOR MOLDING PROCESSING, PACKING CASE, AND BATTERY DEVICE.' Other related details are as follows:

Application Number: JP,2022-169761

Category (FI): B65D65/40@D,B32B27/00@D,B32B27/20@Z,H01M50/105,B32B15/08@F,H01M50/131,H01M50/121,H01M50/129,H01M50/119,B65D85/88,H01M50/122

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Oct. 24, 2022

Publication Date: May 9, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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