Japan Intellectual Property Rights: PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGING SUBSTRATE

Japan, July 31 -- ABSOLICS INC has got intellectual property rights for 'PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGING SUBSTRATE.' Other related details are as follows:

Application Number: JP,2024-201141

Category (FI): H10W70/695,H01L23/14@R,H01L23/14@C,H05K3/46@Q,H05K1/185,H10W70/692,H10W70/68,H10W70/05,H10W70/05,200,H10W70/63,H10W70/68,200,H10W70/00@S

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Nov. 18, 2024

Publication Date: June 11, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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