Japan, April 22 -- TOPPAN PRINTING CO LTD has got intellectual property rights for 'MULTILAYER WIRING BOARD, SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR MULTILAYER WIRING BOARD.' Other related details are as follows:
Application Number: JP,2022-005945
Category (FI): H01L23/12@N,H10W70/685,H05K3/46@B,H05K3/18@G
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 18, 2022
Publication Date: July 28, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....