Japan, Oct. 21 -- SAMSUNG ELECTRO-MECHANICS CO LTD has got intellectual property rights for 'MULTILAYER ELECTRONIC COMPONENT.' Other related details are as follows:
Application Number: JP,2022-183886
Category (FI): H01G4/30,201@K,H01G4/30,201@G,H01G4/30,516,H01G4/30,512,H01G4/30,513,H01G4/30,201@C,H01G4/30,201@F
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Nov. 17, 2022
Publication Date: July 13, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....