Japan, Aug. 12 -- QUALCOMM INCORPORATED has got intellectual property rights for 'MULTI-BAND MILLIMETER-WAVE (mmW) ANTENNA ARRAY AND RADIO-FREQUENCY INTEGRATED CIRCUIT (RFIC) MODULE.' Other related details are as follows:
Application Number: JP,2024-071471
Category (FI): H01Q23/00,H01Q21/24,H01Q21/30
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 25, 2024
Publication Date: Aug. 6, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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