Japan Intellectual Property Rights: METHOD OF PRODUCING SILICA SOL, POLISHING METHOD, METHOD OF PRODUCING SEMICONDUCTOR WAFER, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Japan, Oct. 7 -- MITSUBISHI CHEMICAL CORP has got intellectual property rights for 'METHOD OF PRODUCING SILICA SOL, POLISHING METHOD, METHOD OF PRODUCING SEMICONDUCTOR WAFER, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2022-000649

Category (FI): B24B37/00@H,H01L21/304,622@D,C09K3/14,550@D,C01B33/146,H01L21/304,622@B,H10P52/00@H,H10P52/00@F,H10P52/40,H10P52/00@T

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Jan. 5, 2022

Publication Date: July 18, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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