Japan, Aug. 24 -- HERAEUS MATERIALS SINGAPORE PTE LTD has got intellectual property rights for 'METHOD OF PRESSURELESS SINTERING FOR CONNECTING ELECTRONIC COMPONENTS.' Other related details are as follows:
Application Number: JP,2025-006639
Category (FI): H10W72/30@C,B22F9/00@B,B22F7/04@D,B22F1/00@K,H01L21/52@C
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 17, 2025
Publication Date: Aug. 1, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....