Japan, March 24 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'METHOD OF MANUFACTURING WAFER.' Other related details are as follows:
Application Number: JP,2022-102944
Category (FI): H01L21/304,611@Z,H10P54/20,101,H10P54/30
Stage: Grant (IP right document published.)
Filing Date: June 27, 2022
Publication Date: Jan. 15, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....