Japan, June 10 -- EBARA CORP has got intellectual property rights for 'METHOD FOR REMOVING LIQUID FROM UPPER SURFACE OF WAFER TO BE POLISHED.' Other related details are as follows:

Application Number: JP,2025-046738

Category (FI): B24B37/30@E,B24B37/10,H01L21/304,622@K,H10P52/00@N,H10P52/00@T,H10P52/40

Stage: Grant (IP right document published.)

Filing Date: March 21, 2025

Publication Date: June 5, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....