Japan, June 10 -- DISCO CORP has got intellectual property rights for 'METHOD FOR PARTITIONING WAFER.' Other related details are as follows:
Application Number: JP,2022-134988
Category (FI): H01L21/78@Q,H01L21/78@B,H10P58/00@B,H10P58/00@Q
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 26, 2022
Publication Date: March 7, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....