Japan, June 10 -- DISCO CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING WAFER.' Other related details are as follows:
Application Number: JP,2022-011228
Category (FI): H01L21/52@C,H10W72/30@C,B23K26/57
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 27, 2022
Publication Date: Aug. 8, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....