Japan, June 25 -- GLOBALWAFERS JAPAN CO LTD has got intellectual property rights for 'METHOD FOR MANUFACTURING SILICON WAFER.' Other related details are as follows:

Application Number: JP,2022-206404

Category (FI): H10P95/90,101@X,H01L21/322@Y,C30B29/06@A,C30B33/02,H01L21/324@X,H10P36/20

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Dec. 23, 2022

Publication Date: July 4, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....