Japan Intellectual Property Rights: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR PEELING SUBSTRATE

Japan, Sept. 3 -- KIOXIA CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR PEELING SUBSTRATE.' Other related details are as follows:

Application Number: JP,2023-031991

Category (FI): H10P10/00@Z,H01L29/78,371,H10B43/50,H10B41/50,H10B41/27,H01L21/02@B,H01L21/02@C,H10P90/00@B,H10P56/00@Z,H10D30/69,H10D30/68,H10D30/01,501,H10B43/27

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 2, 2023

Publication Date: Sept. 12, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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