Japan, March 27 -- TALENT HUB INVESTMENT CO has got intellectual property rights for 'METHOD FOR MANUFACTURING CONDUCTIVE MATERIAL HAVING LARGER SPECIFIC SURFACE AREA AND STRUCTURE THEREOF.' Other related details are as follows:
Application Number: JP,2024-012144
Category (FI): H01G11/32,H01G11/36,H01G11/86,H01M4/62@Z
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 30, 2024
Publication Date: March 7, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....