Japan Intellectual Property Rights: METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

Japan, June 10 -- DOWA METALTECH KK has got intellectual property rights for 'METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:

Application Number: JP,2022-120934

Category (FI): H10W70/05,200,H10W70/00@J,H01L23/12@C,H01L23/46@Z,H10W70/68,200,H10W70/20,H01L23/12@J,H01L23/14@M,H01L23/12@D,H10W40/20@C,H10W40/47,H10W76/17@B,H10W76/01,H10W40/60@Z,H01L23/40@Z,H01L23/36@C

Stage: Grant (IP right document published.)

Filing Date: July 28, 2022

Publication Date: Feb. 8, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....