Japan, June 10 -- TOWA CORP has got intellectual property rights for 'MEASURING DEVICE, RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE.' Other related details are as follows:
Application Number: JP,2024-085830
Category (FI): H10W74/47,B29C43/18,B29C43/58,H01L21/56@R,H01L23/30@R,H10W74/01@R
Stage: Grant (IP right granted following substantive examination.)
Filing Date: May 27, 2024
Publication Date: Dec. 9, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....