Japan, March 25 -- SEIKO EPSON CORP has got intellectual property rights for 'MATERIAL DELIVERY DEVICE, THREE-DIMENSIONAL MOLDING DEVICE, AND INJECTION MOLDING DEVICE.' Other related details are as follows:
Application Number: JP,2021-201476
Category (FI): B29C45/17,B29C64/106,B29C64/209,B29C64/321,B33Y10/00,B33Y30/00,B33Y50/02,B29C64/393
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 13, 2021
Publication Date: June 23, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....