Japan Intellectual Property Rights: MATERIAL BETWEEN COMPONENTS IN MICROELECTRONIC ASSEMBLY WITH DIRECT COUPLING

Japan, July 1 -- INTEL CORP has got intellectual property rights for 'MATERIAL BETWEEN COMPONENTS IN MICROELECTRONIC ASSEMBLY WITH DIRECT COUPLING.' Other related details are as follows:

Application Number: JP,2021-158531

Category (FI): H01L23/14@R,H10W40/20,H10W90/00,910@Z,H10W90/00,H10W70/695,H10W70/692,H10W40/60@M,H10W40/20@Z,H10B80/00,H01L23/36@Z,H01L23/14@C,H01L23/36@D,H01L25/10@Z,H01L25/04@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 28, 2021

Publication Date: June 27, 2022

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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