Japan, March 25 -- DENSO CORP has got intellectual property rights for 'MANUFACTURING SYSTEM OF SILICON CARBIDE SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SILICON CARBIDE SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2022-120622
Category (FI): G01N21/956@A,H10P74/20@N,H10P14/20,H01L21/20,H01L21/66@N,G01N21/88@K,H10D30/01,301@L,H10D30/66,101@T,H10D8/01@B
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 28, 2022
Publication Date: Feb. 8, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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