Japan, July 9 -- ELEPHANTECH INC has got intellectual property rights for 'MANUFACTURING METHOD OF PRINTING CIRCUIT BOARD AND CONDUCTIVE GROUND LAYER FORMATION METHOD.' Other related details are as follows:
Application Number: JP,2025-152206
Category (FI): H05K1/11@H,H05K3/10@D,H05K3/12,610@B,H05K3/40@E
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Sept. 12, 2025
Publication Date: Nov. 14, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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