Japan, Feb. 18 -- IMH INC has got intellectual property rights for 'MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DISSIPATION SUBSTRATE FOR SEMICONDUCTOR.' Other related details are as follows:
Application Number: JP,2024-120675
Category (FI): H01L23/46@Z,H05K7/20@N,H05K7/20@R,H10W40/00,100,H10W40/47
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 26, 2024
Publication Date: Feb. 14, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....