Japan Intellectual Property Rights: MANUFACTURING METHOD FOR LAMINATED DEVICE CHIP

Japan, Sept. 16 -- DISCO CORP has got intellectual property rights for 'MANUFACTURING METHOD FOR LAMINATED DEVICE CHIP.' Other related details are as follows:

Application Number: JP,2022-140484

Category (FI): H01L21/78@Q,H10P58/00@Q,H10W90/20@B,H01L25/08@B

Stage: PROBLEM TO BE SOLVED: To easily manufacture a laminated device chip including an extremely thin chip.SOLUTION: A manufacturing method for a laminated device chip includes preparing a first device wafer in which a plurality of first planned dividing lines are set on the surface and a first device is formed in each region partitioned by first scheduled dividing lines, a second device wafer in which a plurality of second planned dividing lines are set on the surface and second devi...