Japan Intellectual Property Rights: LIQUID SURFACE PROTECTION MATERIAL FOR SEMICONDUCTOR WAFER PROCESSING, PROTECTION FILM MADE OF LIQUID SURFACE PROTECTION MATERIAL FOR SEMICONDUCTOR WAFER PROCESSING, AND PROCESSING METHOD FOR SEMICONDUCTOR WAFER

Japan, Sept. 14 -- NITTO DENKO CORP has got intellectual property rights for 'LIQUID SURFACE PROTECTION MATERIAL FOR SEMICONDUCTOR WAFER PROCESSING, PROTECTION FILM MADE OF LIQUID SURFACE PROTECTION MATERIAL FOR SEMICONDUCTOR WAFER PROCESSING, AND PROCESSING METHOD FOR SEMICONDUCTOR WAFER.' Other related details are as follows:

Application Number: JP,2022-189164

Category (FI): H01L21/304,631,H10P52/00@M,H10P52/00@C,C09D5/02,C09D133/06,H01L21/304,622@J

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Nov. 28, 2022

Publication Date: June 7, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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