Japan, March 25 -- NIHON SUPERIOR CO LTD has got intellectual property rights for 'LEAD-FREE SOLDER ALLOY AND SOLDER JOINT.' Other related details are as follows:
Application Number: JP,2021-162331
Category (FI): C22C13/02,B23K35/26,310@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Sept. 30, 2021
Publication Date: April 11, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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