Japan, April 1 -- DENKA CO LTD has got intellectual property rights for 'LCP RESIN COMPOSITION FOR CIRCUIT BOARD, AND LCP FILM FOR CIRCUIT BOARD.' Other related details are as follows:

Application Number: JP,2024-140570

Category (FI): C08J5/18,H05K1/03,610@M,C08L67/00,C08L39/04

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Aug. 22, 2024

Publication Date: Oct. 31, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....