Japan, Aug. 12 -- DISCO CORP has got intellectual property rights for 'LASER PROCESSING DEVICE AND WAFER GENERATION METHOD.' Other related details are as follows:

Application Number: JP,2022-127997

Category (FI): H10P54/30,B23K26/0622,H10P54/90,101@Z,H10P54/20,101,H10P54/50,B23K26/53,H01L21/304,611@Z,B23K26/067

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Aug. 10, 2022

Publication Date: Feb. 26, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....