Japan, July 1 -- JSW AKTINA SYSTEM CO LTD has got intellectual property rights for 'LASER CUTTING DEVICE, LASER CUTTING METHOD, AND DISPLAY MANUFACTURING METHOD.' Other related details are as follows:

Application Number: JP,2021-186715

Category (FI): B23K26/38@Z,C03B33/09

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Nov. 17, 2021

Publication Date: May 29, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....