Japan Intellectual Property Rights: IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPLITTING PROCESS

Japan, June 25 -- II-VI DELAWARE INC has got intellectual property rights for 'IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPLITTING PROCESS.' Other related details are as follows:

Application Number: JP,2025-003918

Category (FI): H10P54/30,H10P30/20@Z,H01L21/265@Q,H10P30/20@Q,B24B1/00@B,H01L21/265@Z,H01L21/304,611@Z,H10P90/00@C,H10P54/50,H10P54/90,101@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Jan. 10, 2025

Publication Date: July 25, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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