Japan Intellectual Property Rights: HEATING DEVICE AND SUBSTRATE PROCESSING APPARATUS

Japan, Sept. 18 -- TOKYO ELECTRON LTD has got intellectual property rights for 'HEATING DEVICE AND SUBSTRATE PROCESSING APPARATUS.' Other related details are as follows:

Application Number: JP,2022-077487

Category (FI): H01L21/31@C,H01L21/68@N,H01L21/324@K,H10P14/60,101@C,H10P72/70,H01L21/324@Q,H10P95/90,101@J,H10P95/90,101@Q

Stage: PROBLEM TO BE SOLVED: To improve in-plane heating uniformity of a substrate heated by a heating device that heats a substrate to be placed without increasing the thickness of the heating device.SOLUTION: A heating device heats a substrate that is directly placed or indirectly placed with another member therebetween, and has a linear heater, and a base material that is recessed toward the substrate from the op...