Japan, Oct. 7 -- DENSO CORP,TOYOTA MOTOR CORP,MIRISE TECHNOLOGIES CORP,MONATEC CO LTD,SHIKOKU INSTRUMENTATION CO LTD,TAIYO KANAAMI KK has got intellectual property rights for 'HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE.' Other related details are as follows:
Application Number: JP,2023-032766
Category (FI): H05K7/20@R,F28D15/02,101@H,F28D15/02,101@G,F28D15/04@C,H01L23/46@A,H10W40/73,100,F28D15/02@L
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 3, 2023
Publication Date: Sept. 13, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....