Japan, June 16 -- DISCO CORP has got intellectual property rights for 'GRINDING DEVICE AND WAFER GRINDING METHOD.' Other related details are as follows:

Application Number: JP,2022-083479

Category (FI): H01L21/304,631,B24B49/03@Z,B24B7/00@A,H10P52/00@C,B24B41/06@L

Stage: Grant (IP right granted following substantive examination.)

Filing Date: May 23, 2022

Publication Date: Dec. 6, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....