Japan Intellectual Property Rights: EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING ARTICLE

Japan, March 24 -- SAMSUNG ELECTRONICS CO LTD has got intellectual property rights for 'EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING ARTICLE.' Other related details are as follows:

Application Number: JP,2021-133427

Category (FI): C07D405/14,C07D407/14,C07D409/14,C07D413/14,C07D417/14,C07F9/6568,C07F9/6581,C08G59/26,C08G59/30,C08K3/013,C08L63/00@C,H01B1/12@Z

Stage: Grant (IP right document published.)

Filing Date: Aug. 18, 2021

Publication Date: March 3, 2022

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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