Japan Intellectual Property Rights: ELECTRONIC COMPONENT PACKAGE AND MANUFACTURING METHOD THEREOF

Japan, July 31 -- ARIMA LASERS CORP has got intellectual property rights for 'ELECTRONIC COMPONENT PACKAGE AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:

Application Number: JP,2023-128531

Category (FI): H01S5/02257,H10W76/10@Z,H10W76/67,100,H10W76/10,H10W76/67,H01S5/02212,H01S5/0231,H01S5/02345,H01S5/02325,H10W76/01,H10W76/10@F,H01L23/02@Z,H01L23/10@A,H01L23/02@F

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Aug. 7, 2023

Publication Date: Feb. 16, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....