Japan, July 1 -- SAMSUNG ELECTRO-MECHANICS CO LTD has got intellectual property rights for 'ELECTRONIC COMPONENT AND MOUNTING BOARD THEREOF.' Other related details are as follows:
Application Number: JP,2021-097418
Category (FI): H01G2/06@C,H01G2/06@B,H01G2/06,500,H05K1/18@H,H01G4/228@W,H05K3/341,H05K3/34,501@D,H05K1/181@B,H01G4/30,201@H,H01G4/30,513,H05K3/3478,H01G4/228@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 10, 2021
Publication Date: May 16, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....