Japan Intellectual Property Rights: DICING DIE BOND FILM

Japan, Sept. 14 -- NITTO DENKO CORP has got intellectual property rights for 'DICING DIE BOND FILM.' Other related details are as follows:

Application Number: JP,2023-015209

Category (FI): H01L21/52@E,H10P58/00@M,C09J201/00,C09J133/00,C09J7/38,H10W72/30@E,H01L21/78@M

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Feb. 3, 2023

Publication Date: Sept. 14, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....